Dr. Sunlin Chou
VP and General Manager, Technology and Manufacturing Group
Intel Corporation

Rapid scaling of silicon devices to smaller dimensions continues to be the best way to extend the success of the semiconductor industry and its pacesetting role in advancing the internet economy. As evolutionary silicon scaling techniques approach practical limits, the industry plans to overcome these limits by integrating new types of materials and devices into the silicon technology base. The industry is already changing materials used for interconnect metals and dielectrics, in both silicon wafers and packages. Searches are under way for new transistor gate dielectrics and device structures. New lithographic processes and tools under investigation will also employ non-traditional materials. The semiconductor industry is entering a period of technological renewal which will offer unusually exciting opportunities for those engaged in materials and device innovation.